IEEE 1101.2 PDF

Vujora Your request to send this item has been completed. In the convection-cooled configuration, air flow over the card is used to remove component heat. Legal notices Photo Preview this item Preview this item.

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Dokazahn IEEE — January A card guide 18 is attached to the convection-cooled chassis 12 with for example, screws, for receiving the card 7 by its protrusion 4. Get a quote for certification of systems, products or services, and get certified. There are several factors driving this interest in CompactPCI:. Other variations and modifications of the present invention will be apparent to those of skill in the art, and it is the intent of the appended claims that such variations and isee be covered.

Once this specification was available conduction cooled boards from different manufacturers could be used in the same system with no mechanical fit issues. Thermal conductance retainer for electronic printed circuit boards and the like.

As mentioned above, none of these references appear to satisfy the IEEE standards of current interest. Cancel Forgot your password? An adapter for commercial off-the-shelf COTS circuit card modules resulting in increased cooling efficiency. Device for increased thermal conductivity between a printed wiring assembly and a chassis. In particular, the frame 1 is extended with extension 16 to utilize the contact area 40the width of wedgelock 3 can be extended, and the strip 15 fully utilizes the space under the protrusion 4.

Commercially-available, off-the-shelf components The present invention is depicted in FIG. In most cases the mating surface is the wall of the systems enclosure. These two effects reduce the efficiency of movement of the heat to the cold wall of the chassis. Terms and Conditions Terms of subscription Online watch.

Please create a new list with a new name; move some items to a new or existing list; or delete some items. High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact. Purchase More information add to basket. The embodiment of FIG. The E-mail Address es field is required. Fite Date of publication: The ieeee thermal path is through the lower surface of component 6 to the end of circuit card 7 to chassis cold wall 2 via metal strip 5 or shim. A second important result of the alteration or augmentation is that the frame 11 a restructured frame 1 of FIG.

The novel features of the present invention will become apparent to those of skill in the art upon examination of the following detailed description of the invention or can be learned by practice of the present invention.

You may have already requested this item. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between. The improved cooling efficiency is achieved, at least in part, through the use of a larger wedgelock TOP Related Articles.


IEEE 1101.2

Aragor Also similar to the embodiment of FIG. The configuration of FIG. Please select Ok if you would like to proceed with this request anyway. DIN EN remains valid alongside this standard until In the present invention, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall.


IEEE 1101.2 PDF

Moogujora An improvement to an existing commercial off-the-shelf COTS circuit card module cooperating with a conduction-cooled chassis that receives the circuit card module resulting in increased cooling efficiency, the circuit card module having at least one printed wiring board PWBthe PWB having a protrusion at one end thereof, at least one component operatively connected to the PWB, a heat path between the component and the chassis, and a frame in contact with the The adapter frame of the present invention comprises an extended width wedgelock 13an extended width shim 15and an extension 16 to iere existing frame 1 so that the circuit card module contacts the cold wall of the conduction-cooled chassis 2. Caution the offer 1 user is reserved for a single user, any broadcast even within his company is prohibited. The heat efficiency of this thermal path is directly affected by the clamping force exerted by wedgelock 3 i. The module of FIG. The invention is efficient in removing heat from the COTS circuit card modules as it increases the conduction contact area between the chassis cold wall and the COTS module. A full appreciation of the various aspects of iefe invention can only be gained by taking the entire specification, claims, drawings, and abstract as a whole.


Nilkree Please select Ok if you would like iefe proceed with this request anyway. Thus, with an approximately 40 Watt W module, for example, there is an average 8. It is yet a further object of the present invention to increase the conduction contact area between the frame of the circuit card module and the chassis. Further, the frame 11 eliminates the need for the metal strip 5 of FIG. There are several factors driving this interest in CompactPCI:. A commercially-available wedgelock 13 suitable for use in the present invention is the Card-Lok product which can be obtained from Calmark Corp. More information add to basket.



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